Impact of the Major Earthquake in Northern Japan on Torex : Status Update No. 4

Mar 22, 2011

Wafer Fab: We can report that production has now re-started at the Fab and that there doesn't appear to be any damage to the products.

Packaging Plant: We have been informed that packaging is scheduled to re-start gradually from March 24th (Thursday).
In addition, those products that were already packaged have now been shipped and arrived with us on March 22nd.

We are putting in every effort to try and get our operations back to normal as quickly as possible.
The website will be updated with new information as it becomes available.

TOREX SEMICONDUCTOR LTD.

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